Testing and Validating for heat isnks
We are very concerned about the testing of products, mainly because of the quality issues involved, but also a responsible attitude towards customers.
Testing and validating are crucial steps in the development process of thermal design systems, and various other heat sink ,liquid cold plate products. These steps ensure that the product meets the required specifications, functions as intended, and is reliable for its intended use.
Themal resistence test for the heat sinks.
The only standard to judge the performance of a heat sink is usually to test the thermal resistance. Generally speaking, we will do simulated heating jig instead of the customer’s real heating chip. Although there are differences between the two, we can see whether the thermal conductivity of the heat sink material is qualified through a simple heating module, especially for the products of soldinging process, including heat pipe modules. Sometimes it is very difficult to judge the quality of heat pipe in the finished product stage. At this time, thermal resistance test must be carried out, because the heat pipe in the high-temperature welding condition, whether there is leakage .
Mechanical testing
After the heat sink processing is completed to ensure the reliability of the product, we need to test its shock resistance, impact test to see if there is deformation or if there is damage to the heati sink with heat pipes
Fluid testing
Under certain fluid pressure conditions, there will be no leakage in the liquid-cooled plate, which depends on the level and stability of the welding process. Currently, our test method involves a pressure test at 1Mpa for 30 minutes
Thermal testing
The standard to measure a heat sink is the thermal resistance test, we produce each heat sink for customers, need to test its thermal resistance value, this is because the thermal resistance value is a key factor affecting the stability of the chipset.
The importance of Testing
Testing involves executing the product or system with the intention of finding defects or verifying its functionality. The primary goal is to identify any discrepancies between expected and actual outcomes. Before we make radiators and liquid cooling plates, we will use thermal analysis software ICEPAK software to simulate and analyze the given power, parameters and other data, whether it is suitable for the normal working temperature of the chip.Based on these data, we finished the sample, such as through CNC machining, wire cutting and other ways to complete the sample production, this time the test is particularly important.
The importance of Validating
Validation is the process of evaluating a system or product during or at the end of the development process to determine whether it satisfies the specified requirements, focusing on its overall effectiveness, completeness, and suitability for intended use.
Therefore, before putting into the actual production heat sink or liquid cooling plate, it is necessary to simulate and detect its performance through appropriate functional tests.We use the data collected from these tests to refine and improve our heat sink designs.Of course, another important reason is that potential failure problems can be found after the test, such as issues with the liquid cold plate and heat sink structure, and some potential risks can be prevented in advance.
What are the contents of machining test？
2, Packing Drop Testing
3, Salt Spray Corrosion Testing.
4, For Screw Holes, Torque Testing.
5, Heat Sink Mechanical Strength Testing.
6, Heat Pipes Tensile Strength Testing.
7. Fan’s Life and Reliability Testing.
8. Aluminum 6061/6063 Hardness Testing
What are the contents of fluid test？
2. Heat Pipe Capillary Pressure and Permeability.
3. Helium Leak Testing for CPU Copper Cold Plate.
4. Leak/Proof Testing and Hydrostatic to 0.7-1.2 Mpa.
5. Liquid Cooling Thermal and Flow Resistance Testing.
6. Gas or Liquid Cycle Pressure Retention Testing.
What are the contents of heat sink or liquid cold plate thermal testing？
2. Heat Pipe Thermal Resistance and Qmax testing.
3. Thermal Pad Interface Resistance Testing.
4. Thermal Testing (Power, Heat Load, Heat Flux, Temperature and 100% Final Assembly Thermal Testing)
5. Fan air Volume And Pressure Testing.
Our Kenfa Tech Testing and Validating Goal.
Our testing and balidating goal is to ensure that products and solutions are designed to meet customer application requirements and product standards, such as CPU heat sinks for computer servers and liquid cooling panels for battery packs in the automotive industry. Our products involve various fields of the electronics industry, and our engineers are familiar with the standards of each industry.
For example, the natural heat sink of a 5G base station is typically designed and processed using die-casting techniques for the heat sink. It has a waterproof rating of IP65, and high-power areas require heat pipe solutions to be implemented. Our engineers work closely with customers to ensure that their product specifications and unique requirements are met, with the goal of fully ensuring the proven reliability of our products.”
