Skived Fin Heat Sink
Skived fin process heat sinks flexible dimensions, can customize the heat sink density of a process, to provide customers with the shortest period of high power heat sink program. The skived fin process heat sinks, which is used for heat dissipation schemes of high-power frequency converter, controller, wind inverter, IGBT and other semiconductors
What is a skived heat sink?
The process of skived fin heat sink is based on a flat aluminum material. After heat treatment, its hardness is reduced. Under the mechanical action, the tilting Angle of the tool is controlled by the customized tool and the program written, and the aluminum plate is evenly cut into a flake structure under the pressure of the hydraulic press.
The advantage of this kind of heat sink is that it can meet the customer’s demand for high-power chip heat dissipation.
Theoretically, the heat sink of the profile process is limited by the process. In general, the fin height of the heat sink can only be about 25 times the spacing, which means the height of the heat sink is 25mm, so the spacing is 1mm. It cannot meet the requirements of high-density heat sinks. Therefore, heat sinks with fin processing can be arbitrarily set with fin of less than 130 height and width of less than 700mm according to customers’ requirements.The advantages of high-efficiency production and processing, no need for mold fees, short product sample development time, and freely defined large-sized heat sinks are the biggest advantages of this type of heat sink
Efficient heat sink manufacturing process
Skived fin process heat sinks flexible dimensions, can customize the heat sink density of a process, to provide customers with the shortest period of high power heat sink program. The skived fin process heat sinks, which is used for heat dissipation schemes of high-power frequency converter, controller.It is an efficient radiator processing technology, and the key to its manufacturing process lies in precise process control. Firstly, through advanced CNC milling technology, precise cutting of metal materials is achieved to form a highly detailed heat dissipation fin structure. These tiny fins increase the surface area and improve heat dissipation performance. Subsequently, precise cutting tools and molds are used for fine machining to ensure consistent gaps and shapes between fins, optimizing air flow to the greatest extent possible.
How to Make a Skived Fin Heat Sink?
When we are making a skived fin heat sink, we need to determine its material. Generally speaking, we will use a little more aluminum material. This way, we will create a profile mold, which is simply a rectangular section of aluminum plate. Using our mechanical processing formula, we will calculate the required shovel fin height and ultimately determine the height of an aluminum plate. According to the size requirements of the customer, we generally have three types of machines, one is a large shovel fin machine, This type of machine can generally skived aluminum plates up to 3 meters long, which is relatively efficient.
Another type of machine is a precision CNC type. The advantage of this machine is that it can skive about 1 meter, and the spacing and thickness of the fin can be guaranteed to be accurate. It also plays a very important role in reprocessing the tailings of the large machine mentioned above, which saves costs and avoids the loss of tailings.
We also have a machine that is mainly used for micro channel fin machining. This product is mainly used for heat dissipation of computer chips in large computer computing centers and data computing centers, as well as heat exchange of high-density liquid cold plates
What Are The Characteristics of The Skived Fin Heat Sinks?
● The material is generally Aluminum1060/6063/C1100;
● The heat sink surface can be sprayed with oil or powder, anodized finishing;
● Heat sink product without any tooling charging , suitable for small or large production
● Product processing time is relatively low, high production efficiency;
● Generally speaking, the length, width and height of the products are 2000X700X130mm we can make.
● The heat sink base is 1-30mm, Fin thickness is 0.1-2.0mm; fin gap 0.1-6.5mm;
● Our usual process of making this product is to get the customer’s drawing, we will do the DFM feedback, and then make the sample. After the sample is finally confirmed, we will mass produce;
● Our general sample production cycle is 3 weeks, the production cycle of mass production is 4 weeks
A Skived Fin Heat Sink With Heat Pipes
In our actual application cases, some of our heating chips have relatively high power and are also relatively dense, which means that the thermal power per unit area is very large, and the local heat is very concentrated. At this time, we can choose to use copper material heat sinks as the base plate to accelerate the diffusion of heat, and then transfer the heat to the fin of the heat sink. However, this process is difficult to achieve copper aluminum combination, That is to say, the welding process is relatively complex, while the cost is relatively high and the weight is heavy.This disadvantage is quite obvious.
To solve this problem, we usually adopt the method of embedding the bottom plate into the heat pipes, and then use the super strong conductivity of the heat pipe to transfer a large amount of accumulated heat to other areas, and then use fin to release the heat into the air.
Of course, there are certain gaps in the contact area between the heat pipe and the bottom plate. At this time, we usually need to use high thermal conductivity epoxy adhesive to fill these gaps, which can ensure a close connection between the heat pipe and the bottom plate of the heat sink. At the same time, we also use our patented groove technology to control the tolerance matching between the heat pipes and the bottom plate groove.
But there are also some customers’ products are very high power, high heat density, the use of soldering paste welding of method is more efficient.Electroplate a layer of nickel on the surface of the heat sink, add solder paste on the diagram, and then bake in a high-temperature reflow furnace at 230 degrees Celsius for about 30 minutes. This way, the solder paste is tightly connected to the heat pipe and bottom plate,
You Need to Think When You Design A Skived Fin Heat Sink
• Are you using Natural or Forced Convection for cooling your chipset?
• Will you need machining or detailed mounting screw holes for the heat sink?
• What is the maximum ambient temperature that your device will be operating in?
• How much power is your device dissipating?
• What is your maximum device case temperature?
• What is your device size and heat source footprint?
• How much room do you have for your skived fin heat sink?
How to Help Customers Design A Skived Fin Heea Sink？
Thermal simulation analysis is a very important process, especially for new design projects. Early stage simulation analysis can shorten the product development cycle and save costs. We usually tell our customers whether they need to provide them with a thermal analysis solution. If customers do not have the design ability, we usually design the optimal solution for them for free, which can save them development time and costs, Generally speaking, it can save 30% of product development time and 50% of research and development costs.
-Thermal power：
We need the thermal power of the customer’s chip, as well as the position on the PCB, which corresponds to the position on our liquid cooled plate. Based on the size and position of this chip, we will develop detailed flow channels and microchannels. When the power density is high, we will consider designing microchannels with local encryption.
-Environment temperature:
We need to know the working environment temperature of this product in order to set it for operation in our software. Usually, we set the temperature to around 35 or 45 degrees Celsius. Of course, if we encounter a laser module pump source, we set the environmental temperature to 25 degrees Celsius, depending on the customer’s requirements.
-The specifications of the fan:
We need to know the working environment temperature of this product in order to set it for operation in our software. Usually, we set the temperature to around 35 or 45 degrees Celsius. Of course, if we encounter a laser module pump source, we set the environmental temperature to 25 degrees Celsius, depending on the customer’s requirements
Standard Specification Dimensions Are As Follows
Based on our over 10 years of understanding of customer products and their applications, we have summarized many rules, such as the size required for products with different powers. We have made some standard products according to this rule, in order for R&D engineers to quickly find suitable products for thermal testing. Therefore, we have our own patented products and detailed drawing parameters that can be referred to by engineers as follows:
| Part Number | Size(mmLxWxH | Fan Spc | Cooling power | Drawing |
| KF-HS-20-SK001 | 100x100x68h | 606025/12v/3500rpm | 200w | Detail information |
| KF-HS-20-SK002 | 100x130x68h | 606025/12v/4000rpm | 300W | Detail information |
| KF-HS-20-SK003 | 100x200x68h | 606025/12v/4500rpm | 400W | Detail information |
| KF-HS-20-SK004 | 200x150x80h | 707025/12V/4500rpm | 500W | Detail information |
| KF-HS-20-SK005 | 200x230x80h | 707025/12v/5000rpm | 600W | Detail information |
| KF-HS-20-SK006 | 200x250x80 | 707025/12v/5500rpm | 700W | Detail information |
| KF-HS-20-SK007 | 200x300x75h | 707025/12v/5000rpm | 800w | Detail information |
| KF-HS-20-SK008 | 300x200x102h | 909038/12v/4500rpm | 1000w | Detail information |
| KF-HS-20-SK009 | 300x300x102h | 909038/12v/5000rpm | 1200W | Detail information |
| Notes: 1.Aluminum, copper can be substituted based on specific requirements | ||||
| 2.Surface treatment requirements can be changed. | ||||
| 3.The production cucle for samples is two weeks | ||||