Thermal design is a very useful discipline that studies the thermal heat sink and conduction of materials, especially when semiconductor chips emit a large amount of heat due to impedance under energized conditions. Therefore, research on heat sink is necessary for the conduction of this heat. At the same time, for how to solve this heat to ensure the stability of chip operation, Thermal design is a very important design tool and solution. Usually, theoretical data calculations may have certain deviations.

However, through continuous learning and accumulation of case studies by our engineers, we can set data that is very close to the actual model. Finally, under the operation and calculation of software, we can obtain a very accurate value for engineers to refer to and optimize thermal design solutions. However, for the same model under the same conditions, using different processes and materials to design heat dissipation schemes or heat sinks, the resulting data can always be very close to the real data. This is why we need to do thermal design and doing analysis, which is to shorten the product development cycle and find the optimal design scheme in a short time.