Highly efficient skived fin heat sink is used for cooling 200W high power chipset

Skived Fin heat sink is an efficient heat dissipation solution. By cutting and forming the metal sheet, a dense heat sink is formed. This design provides a larger surface area for heat dissipation and enhances heat conduction. Skived Fin heatsinks are widely used in electronic equipment, automotive industry and communication equipment to effectively manage heat […]

Battery Cold Plate: A simulation method for thermal management of a direct-cooled battery pack

Abstract:The direct cooling technology (battery cold plate) of the power battery pack has advantages such as high cooling efficiency, compact system design, and no hidden risks of short circuits, and it is receiving increasing attention. However, the complexity of the direct cooling technology poses new challenges for simulation, including intense phase change processes within the […]

A supplier of cold plate, offering complimentary samples, has developed a chipset-cooling water cooling plate capable of handling 1100W.

Key words: 1100W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size: 140x300x19mm; Material: Aluminum6063-T5; Cooling capacity:1100W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps […]

The standard cold plate is provided to achieve high-performance heat dissipation for 400W IGBT.

Key words: 400W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:80x170x19mm; Material: Aluminum6063-T5; Cooling capacity:400W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps […]

Optimization and Exploration of IGBT Heat Dissipation Solution

Today, decarbonization and digitization are pushing power management technology toward new trends. Increasing efficiency, reducing equipment weight, increasing power density, and increasing the range of electric vehicles are all topics of common concern in our daily lives. For a long period of time in the semiconductor industry, the evolution of power semiconductor, analog semiconductor and […]