Abstract: This paper presents a liquid cold plate design for Insulated Gate Bipolar Transistors (IGBTs). The liquid cold plate is an efficient thermal management solution that enhances the heat dissipation performance of IGBTs by directly circulating coolant through the IGBT chips. This design effectively reduces temperature and improves system reliability and performance.
Introduction:
IGBTs are widely used power semiconductor devices in modern power electronic systems. In high-power applications, IGBT chips generate substantial heat, which, if not effectively dissipated, can adversely impact device performance and lifespan. Traditional air cooling methods have limitations in high power density applications, making liquid cooling technology an important solution for IGBT thermal management.
Overview of Liquid Cold Plate Cooling Technology:
Liquid cooling technology utilizes a heat transfer medium, typically water or other fluids, to directly contact and cool the heat source. By circulating the coolant, it efficiently dissipates heat, offering superior thermal management and temperature control compared to traditional air cooling methods.
Principles of IGBT Liquid Cold Plate Design:
The key to IGBT liquid cold plate design lies in establishing an efficient thermal conduction path between the coolant and the IGBT chips. Several aspects need to be considered in the design process:
a. Coolant Circulation System: Designing a well-functioning coolant circulation system, including pumps, coolant pipelines, and flow control devices, ensures stable and sufficient coolant flow.
b. Thermal Interface Materials: Selecting appropriate thermal interface materials with high thermal conductivity, such as silicone gel or thermal paste, minimizes thermal resistance between the coolant and the IGBT chips.
c. Cold Plate Design: The liquid-cooled cold plate needs to possess excellent thermal conductivity and structural integrity. Typically, metallic materials like copper or aluminum are used to efficiently transfer heat to the coolant.
d. Flow Channel Design: The cold plate requires a well-designed flow channel structure to ensure uniform coverage of the coolant over the IGBT chips and induce sufficient turbulence to enhance heat dissipation efficiency.
IGBT Liquid Cold Plate Design Process:
a. Determining Heat Dissipation Requirements: Based on practical application demands, identify the heat dissipation requirements for the IGBT, including maximum temperature and power dissipation.
b. Coolant Selection: Choose a suitable coolant considering heat dissipation requirements and system characteristics, considering factors such as flowability, corrosiveness, and reliability.
c. Cold Plate Size and Material Selection: Determine the dimensions and material of the liquid-cooled cold plate based on heat dissipation requirements and space limitations, considering factors such as material thermal conductivity and cost.
d. Flow Channel Design and Optimization: Design an optimized flow channel structure based on the cold plate dimensions and heat dissipation requirements. Utilize numerical simulation and experimental validation to refine the flow channel design for optimal heat dissipation performance.
e. System Integration and Testing: Integrate the designed liquid-cooled cold plate with the IGBT chips and conduct system-level testing to validate heat dissipation performance and reliability.
Experimental Validation and Performance Evaluation:
After the design process, experimental validation and performance evaluation are necessary. Measure parameters such as temperature distribution on the cold plate, coolant flow rate, and temperature to assess the heat dissipation effectiveness and compare it with the expected performance.
Conclusion:
IGBT liquid cold plate design is an efficient thermal management solution that effectively reduces IGBT temperatures, enhances system reliability, and improves performance. By selecting appropriate coolant, optimizing flow channel design, and conducting experimental validation and performance evaluation, design goals can be achieved, meeting the requirements of various applications. In the future, with further technological advancements, IGBT liquid cold plate design will find broader applications in power electronic devices.
The following is the 3000W IGBT module liquid cooling plate we designed for customers.
There are a total of 6 modules, each module has a power of 500W. The local high-density fin sheet is used to take away a large amount of heat, and at the same time, heat exchange in the water channel can effectively take away heat. We calculated by thermal simulation software, and obtained the convergence function curve and the distribution map of product temperature:
