Soldering process heat sinks
Soldering welded heat sink can usually meet high density heat dissipation requirements, because the heat accumulation of the chip is more concentrated.
200W heat pipe heat sink, soldered process, suitable for forced convection heat dissipation scheme, generally used in LED stage lights,high density heat dissipation field.
Main product information:
-Aluminum 6063 for heat sink base ,Aluminum 1100 for heat sink fins;
– There are five heat pipes with a diameter dimension of 6.0mm;
-Nickel plating on base and fins’ surface;
-Using low temperature solder paste, 120-140 degrees welding temperature;
-Ultrasonic cleaning;
-The bottom heat pipe is treated with oxidation resistance;
-Product size: 123X90X51mm;
-It is packed in wooden cases or cartons;
-Based on the customer’s heat source, we can adjust the position of heat pipe, convenient customer screw hole installation;
-The ambient temperature is generally set at 35 degrees;
-Suitable for about 200W thermal power chipset;
-Suggestion the fan 5050 4500 RPM/29.5CFM;
-After our actual test and simulation analysis, the heat resistance of the heat sink (68-45)/200=0.115
Product size: 123x90x51mm;
Custom service design
This kind of standard product can be provided to customers for testing. Usually, samples can be made in one week. Of course, we can also customize production and design for customers, including fan selection, product size adjustment and other services
You can also download the specifications for this product:
